MOSFET - Biotronics
Product No. Package Type Die Size (With Scribe Lane) Scribe Lane Back Metal Wafer Thickness Gate Pad Size Die Attach Gold Wire PDF Files
F01N65 TO-220 (3 Lead) 1880μm x 1890μm 80μm Ti / Ni / Ag 250μm +/-10μm 266μm x 174μm Epoxy 1 mil Click here to download
F01N65S TO-220 (3 Lead) 1600μm x 1595μm 80μm Ti / Ni / Ag 250μm +/-10μm 266μm x 174μm Epoxy 1 mil Click here to download
F02N65 TO-220 (3 Lead) 2375μm x 2365μm 80μm Ti / Ni / Ag 250μm +/-10μm 266μm x 187μm Epoxy 1 mil Click here to download
F04N65 TO-220F (3 Lead) 2920μm x 2910μm 80μm Ti / Ni / Ag 250μm +/-10μm 370μm x 213μm Epoxy 1 mil Click here to download
F08N65 TO-220 (3 Lead) 3725μm x 3990μm 80μm Ti / Ni / Ag 250μm +/-10μm 526μm x 304μm Epoxy 3 mil Click here to download
F09N65 TO-220 (3 Lead) 4200μm x 4240μm 160μm Ti / Ni / Ag 250μm +/-10μm 526μm x 304μm Epoxy Click here to download
F20N50 TO-3P (3 Lead) 5085μm x 5980μm 80μm Ti / Ni / Ag 250μm +/-10μm 526μm x 333μm Epoxy 3 mil Click here to download
Product No. Package Type Die Size Back Metal Wafer Thickness Gate Pad Size Gate Bonding Wire Source Bonding Wire PDF Files
C10N65 TO-220 (3 Lead) 4330μm x 5180μm Ti / Ni / Ag 250μm 651μm x 355μm 5 mil x 1 15 mil x 6 Click here to download
F13N50 TO-220 (3 Lead) 4340μm x 5120μm Ti / Ni / Ag 250μm 520μm x 320μm 5 mil x 1 15 mil x 6 Click here to download
F14N50 TO-220 (3 Lead) 4330μm x 6520μm Ti / Ni / Ag 250μm 520μm x 320μm 5 mil x 1 15 mil x 6 Click here to download
F14N65 TO-220 (3 Lead) 4330μm x 6520μm Ti / Ni / Ag 250μm 520μm x 320μm 5 mil x 1 15 mil x 6 Click here to download
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